http://asiatoday.com/pressrelease/institute-microelectronics-kicks-copper-wire-bonding-consortium-ii-tackle-copper-interc
The Institute of Microelectronics, in Singapore, has launched the copper wire bonding consortium II. The consortium aims to improve the reliability of semiconductor devices by approaching copper wire issues related to corrosion and stress. Copper has become one of the preferred materials for wire bonding interconnects in microelectronics. The industry still faces many technical challenges in developing copper as the best choice for interconnection. one of the main technical issues is related to copper's hardness relative to gold. Another challenge of using copper is its reactivity with oxygen in the surrounding air which causes corrosion-related problems. These two issues can affect the reliability and quality of semiconductor devices. With all of this said, The Institute of Microelectronics will conduct a study on corrosion and the mechanisms on the effect of various packaging materials. The outcome of this work will enable semiconductor manufacturers as well as test and packaging houses to develop solutions to improve product reliability especially those targeted at high reliability applications.
It will be a great experience for the company and it will definitely boost the economy.
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